SemiVision 🇹🇼 👁️👁️

#ASE is showing what the future AI package could look like — not just more compute, but the convergence of compute, power delivery, and optical I/O in one architecture. At #SEMICON Taiwan, ASE highlighted its roadmap around FOCoS / CoWoS-class computing, silicon photonics & CPO, vertical power deli…

AI data center high-speed interconnects are rapidly evolving from traditional pluggable optical modules toward NPO (Near-Packaged Optics) and CPO (Co-Packaged Optics). Global optical communications leader Coherent is also expanding its presence in the integrated optics market. #Coherent announced t…

ASE Technology Holding, ASE, is positioning itself as a major packaging partner for the CPO era. Its role begins after optical-engine dicing and extends toward OE and OE+ASIC module assembly. As package dimensions move far beyond conventional reticle limits, ASE is preparing both 300 mm wafer-based…

SEMICON Taiwan = a semiconductor conference + a walking marathon. 😂 18,000 steps in one day. Great conversations, great technology, and definitely a great workout. #SEMICONTaiwan #Semiconductor #TechLife https://t.co/uMj4FkapyV

As the HBM Base Die evolves into an SoC, where will the next major redistribution of value across the AI semiconductor supply chain occur? https://t.co/w5sl0WA4Eq https://t.co/pbOk71MBsK